Copper

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Copper Mil Spec Thickness Comments
MIL-C-14550B
Copper in color and matte to a very shiny finish. Good corrosion resistance when used as undercoat. A number of copper processes are available, each designed for a specific purpose. Brightness (to eliminate the need for butting); High speed (for electroforming); Fine grain (to prevent case hardening); etc.



Class 0
Class 1


Class 2

Class 3
Class 4

 Unless otherwise specified
.001-.005”
.001”


.0005”

.0002”
.0001”



For heat treatment stop-off
For carburizing and decarburizing shield, also plated thorugh printed circuit boards.

As an undercoat for nickel and other platings.


To prevent basis metal migration into tin (prevents poisoning solderability).


ASTM Designation: B 734

Electrodeposited Copper for Engineering Uses

Classification

The electrodeposited copper is classified according to thickness of the electrodeposit in the following table:
Class
Minimum Thickness, µM
25
25
20
20
12
12
5
5
X
Thickness specified

* No relationship exists between class numbers and degree of corrosion resistance. Class numbers have been assigned on the basis of traditional usage and for compatibility with national standards.


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